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COVID-19 Impact on Global IC Advanced Packaging Equipment, Market Insights and Forecast to 2026

Published: Jun 2020 Total Pages: 152 | Published By: QYResearch Group

Market Analysis and Insights: Global IC Advanced Packaging Equipment Market

Prior to COVID-19, the market for IC Advanced Packaging Equipment was anticipated to grow from US$ XX million in 2020 to US$ XX million by 2026; it is expected to grow at a CAGR of XX% during 2021–2026, whereas post-COVID-19 scenario, the market for IC Advanced Packaging Equipment is projected to grow from US$ XX million in 2020 (a change by ~XX% compared to market estimated for 2020 before the outbreak of COVID-19) to US$ XX billion by 2026; it is expected to grow at a CAGR of XX% during 2021–2026. The solicitation of proposals by the governments and public–private companies across the world to mitigate the impact of the COVID-19 pandemic is the key factor propelling the growth of the IC Advanced Packaging Equipment market.

Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 200 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt, and will significantly affect the IC Advanced Packaging Equipment market in 2020. The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.

This report also analyzes the impact of Coronavirus COVID-19 on the IC Advanced Packaging Equipment industry.

Global IC Advanced Packaging Equipment Scope and Segment

IC Advanced Packaging Equipment market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global IC Advanced Packaging Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2015-2026.

The following manufacturers are covered in this report:

ASM Pacific

Applied Material

Advantest

Kulicke&Soffa

DISCO

Tokyo Seimitsu

BESI

Hitachi

Teradyne

Hanmi

Toray Engineering

Shinkawa

COHU Semiconductor

TOWA

SUSS Microtec

IC Advanced Packaging Equipment Breakdown Data by Type

Cutting Equipment

Solid Crystal Devices

Welding Equipment

Testing Equipment

Other

IC Advanced Packaging Equipment Breakdown Data by Application

Automotive Electronics

Consumer Electronics

Other

Regional and Country-level Analysis

The IC Advanced Packaging Equipment market is analysed and market size information is provided by regions (countries).

The key regions covered in the IC Advanced Packaging Equipment market report are North America, Europe, China, Japan, Southeast Asia and South Korea. It also covers key regions (countries), viz, the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, UAE, etc.

The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of production capacity, price and revenue for the period 2015-2026.

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